Key Features
• Fast UV curing
• Low dielectric constant (Dk < 2.6)
• High transparency & low haze
• Excellent flexibility & low shrinkage
• Outstanding thermal and weather resistance
• Excellent adhesion & resin compatibility

Typical Properties
Application: Low dielectric flexible OLED encapsulation
Dielectric Constant: < 2.6
Viscosity (25°C): 45 ± 4 cps
Surface Tension (25°C): > 30 mN/m

Typical Applications
• Semiconductor & Optical Packaging
• OLED/LCD Dam & Fill
• Optical Adhesives (OCA/LOCA)
• ITO Touch Panel Protective Coatings
• Fiber Optic Coatings
• UV/EB Curable Coatings