Polyimide /PI materials

Polyimide used as an insulating material for electronic circuit materials is a generic term for polymeric compounds containing imide (- co-nr-co -) bonds. Very high mechanical strength, excellent heat resistance, electrical insulation, and excellent chemical resistance.

Moreover, the expansion rate to the heat is low as an organic substance, and it is used for industrial products because the error due to expansion is small even if it is used even in high heat.

CHEMFISH sell more than 100 kinds of polyimide material. For more information, Please contact sales@chemfish.co.jp

Chemical structure of Polyimide

Commonly used are polyimides that R and R 'are aromatic.

Formation of Polyimide

Polyamic acid is made from diamine + carboxylic acid anhydride (r-co-o-co-r ').

It is heated at 200 degrees Celsius and imidized to obtain polyimide.

Practical trend of Polyimide

Polyimide is widely applied to fields such as aviation, space, microelectronic, nano, liquid crystal, separation film and laser.

Polyimide film is widely used as a flexible printed wiring board for OA equipment and camera, an interlayer insulating material of a wire, a protective film of a semiconductor, etc.

In addition, it is used as a coating material to keep the insulation of the wire in a cellular phone or a personal computer. Heat insulation is required for the insulator which is coated with solder bonded solder, so the heat resistance of polyimide is utilized.